CUI Devices

CUI Devices is an electronic components manufacturer specializing in an ever-expanding range of product technologies. Formerly part of CUI Inc, you can trace our roots back to 1989 just outside of Portland, Oregon. In September of 2019, a group of senior managers deeply involved in the historical growth of CUI Inc—and with over 15 years of average tenure—spun-off part of the business. Thus, CUI Devices was born, offering a wide range of Interconnect, Audio, Thermal Management, Motion, and Sensor solutions.

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Part Number	Manufacturers	Description	View
HSB06-181810	CUI Devices	HEAT SINK, BGA, 18 X 18 X 10 MM	Inquiry
HSB18-232310	CUI Devices	HEAT SINK, BGA, 23 X 23 X 10 MM	Inquiry
HSE-B250-04H	CUI Devices	HEAT SINK, EXTRUSION, TO-220, 25	Inquiry
HSB13-303014	CUI Devices	HEAT SINK, BGA, 30.7 X 30.7 X 14	Inquiry
HSS-C2540-SMT-TR	CUI Devices	HEAT SINK TO-263 COPPER	Inquiry
HSB02-101007	CUI Devices	HEAT SINK, BGA, 10 X 10 X 7 MM	Inquiry
HSS-B20-CP-01	CUI Devices	HEATSINK TO-220 2.6W ALUMINUM	Inquiry
HSE-B20250-040H-01	CUI Devices	HEAT SINK, EXTRUSION, TO-220, 25	Inquiry
HSS08-B18-CP	CUI Devices	HEAT SINK, STAMPING, TO-218, 44.	Inquiry
HSB05-171711	CUI Devices	HEAT SINK, BGA, 17 X 17 X 11.5 M	Inquiry
HSB11-252518	CUI Devices	HEAT SINK, BGA, 25 X 25 X 18 MM	Inquiry
HSB19-272718	CUI Devices	HEAT SINK, BGA, 27 X 27 X 18 MM	Inquiry
HSB03-121218	CUI Devices	HEAT SINK, BGA, 12 X 12 X 18 MM	Inquiry
HSB09-212115	CUI Devices	HEAT SINK, BGA, 21 X 21 X 15 MM	Inquiry
HSB17-404025	CUI Devices	HEAT SINK, BGA, 40 X 40 X 25 MM	Inquiry
HSC-03	CUI Devices	HEAT SINK CLIP FOR HSE-B20350-NP	Inquiry
HSC-05	CUI Devices	HEAT SINK CLIP FOR HSS01-B20-CP	Inquiry
HSC-02	CUI Devices	HEAT SINK CLIP FOR HSE-BX-035H S	Inquiry
HSC-04	CUI Devices	HEAT SINK CLIP FOR HSE-B20X AND	Inquiry
HSC-01	CUI Devices	HEAT SINK CLIP FOR HSE-B18X-035H	Inquiry