All Products
HSB02-101007
- Part Number
- HSB02-101007
- Manufacturer
- CUI Devices
- Description
- HEAT SINK, BGA, 10 X 10 X 7 MM
- Data sheet
-
HSB02-101007.pdf
- Category
- Thermal - Heat Sinks
- Family
- Series
- HSB
Request a Quote
Buy the HSB02-101007 CUI Devices on HK DCY Technology Limited,we are CUI Devices Corporation distributor,we sales new&original and offer 24 hours service,180 days warranty date, send the HSB02-101007 within 24 hours,please contact our sales team or send email to SALES05@HKDCY.COM Hope we can cooperate in the future.
Specifications
| Series | HSB |
|---|---|
| RoHS | RoHS |
| Type | Top Mount |
| Shape | Square, Pin Fins |
| Width | 0.394" (10.00mm) |
| Length | 0.394" (10.00mm) |
| Diameter | - |
| Material | Aluminum Alloy |
| Fin Height | 0.275" (7.00mm) |
| Part Status | Active |
| Package Cooled | BGA |
| Material Finish | Black Anodized |
| Attachment Method | Adhesive |
| Thermal Resistance @ Natural | 37.90°C/W |
| Power Dissipation @ Temperature Rise | 2.0W @ 75°C |
| Thermal Resistance @ Forced Air Flow | 16.50°C/W @ 200 LFM |
- RFQ Email
- SALES05@HKDCY.COM or Inquires online
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